H. Ghasemi, M. A. Faghihi Sani, Z. Riazi,
Volume 4, Issue 3 (12-2007)
Abstract
Abstract: The effect of phase development on peel strength of alumina-copper metalized joint has
been investigated. The alumina-copper joint was prepared in three stages. The alumina substrate
was, first, metalized at 1500°C in H2-furnace by a new formulation. In the second step, a nickel
layer was electroplated on the metalized layer with approximately 10µm thickness. Finally, copper
strips were bonded to metalized alumina with Ag-Cu (72-28) filler metal. The peel strength of the
joint was 9.5±0.5 Kg/cm which shows approximately 30% increase in comparison to previous
works. By study of fracture surface and crack propagation path, it has been concluded that this
increase is due to the formation of more spinel phase.
